Intel plans to mass-produce glass substrates as early as 2026. AMD and Samsung are also interested in adopting glass substrate technology. Compared with the current carriers, glass substrates have better chemical and physical properties and can increase the interconnect density by 10 times. Intel pointed out that glass substrates can increase the chip area in a single package by 50%, thereby accommodating more chiplets. In addition, due to the flatness of the glass and the ability to reduce the optical proximity effect (OPE) by 50%, the focus depth of the lithography can be improved. Relevant practitioners pointed out that although glass can overcome warpage and has good electrical performance, its disadvantages include fragility and difficulty in processing. (Star Daily Report)