According to Nikkei News, Taiwan Semiconductor is exploring a new method of advanced chip packaging, using a rectangular panel-shaped substrate instead of a circular wafer. This will allow more sets of chips to be placed on each wafer. Currently, the research is in its early stages and may take "a few years" to commercialize.
日经新闻：台积电探索新的AI芯片封装技术
Nikkei News: Taiwan Semiconductor is exploring new AI chip packaging technology.
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