Shenzhen Envicool Technology has recently learned that Intel, Bode and Envicool have jointly launched the first multi-platform compatible liquid-cooled aluminum cold plate system to fully utilize the performance of the third to sixth generation Xeon processors. The liquid-cooled aluminum cold plate system can be compatible with the third, fourth, fifth, and sixth generation Xeon processor schemes, and has been verified for actual operation on the Eagle Stream platform in the project, fully meeting the requirements for standardized batch delivery and large-scale commercial conditions, laying the foundation for future large-scale adoption of liquid-cooled servers and data centers.
英特尔、宝德、英维克联合推出首款多平台液冷铝冷板系统
Intel, Bode and Shenzhen Envicool Technology jointly launched the first multi-platform liquid-cooled aluminum cold plate system.
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