According to the official WeChat account of Intel China, today, with the vigorous development of the digital economy and the continuous growth of computing power demand, the traditional air-cooling cooling method has gradually exposed its limitations. In the face of this challenge, liquid cooling technology, with its superior heat dissipation efficiency, is becoming a new trend in data center cooling technology. In this wave of innovation in this field, Intel, server manufacturer Bode and liquid cooling solution provider Shenzhen Envicool Technology jointly developed the first aluminum cold plate system solution (Figure 1), aimed at providing the best performance for high-performance processors and paving the way for future liquid-cooled servers and data centers.