Jefferies Financial released a report stating that according to recent industry channel surveys, TSMC's (TSM.N) advanced packaging technology CoWoS has been fully booked for production capacity in the first half of next year, and the company is negotiating the allocation of production capacity for the second half of next year with customers. Price is believed to be one of the topics under discussion, and it is believed that TSMC may raise prices of all AI acceleration products by 5% to 10% next year, which will help drive a new round of profit forecast revaluation. In response to strong customer demand, CoWoS's production capacity in the second half of next year is expected to be further increased. The report pointed out that Apple, TSMC's largest customer, has released new AI functions, and it is believed that the full-year wafer order forecast for Apple will increase, and the sales prospects for Apple will improve, which is expected to drive TSMC to raise its guidance target for this year. The report also believes that TSMC's gross margin will return to a healthier level next year, raising its target price on the Taiwan Stock Exchange from TWD 900 to TWD 1,050, and maintaining a buy rating as the most attractive company in the AI field.