Today's official WeChat news is that the 2024 China International New Energy Industry Expo will be held from May 29 to 31. Weifu will be showcasing material solutions for the automotive electronics industry. Among them, the company will launch a bottom filler product, which will greatly improve the reliability and stability of automotive chips.
唯特偶：将首发底部填充胶产品 可极大提高汽车芯片可靠性
Weifu: Launching the first underfill adhesive product can greatly improve the reliability of automotive chips
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