Debon Securities released a research report saying that on May 21, SK Hynix's senior management Kwon Jae-soon said that SK Hynix's HBM3E yield is close to 80%. He emphasized that SK Hynix will focus on producing 8-layer stacked HBM3E this year. Earlier, Guo Luzheng, CEO of SK Hynix, announced on May 2 that the company's HBM has been sold out all this year and will almost be sold out next year, and is expected to provide samples of the world's highest performing 12-layer stacked HBM3E products in May of this year, and is preparing to begin mass production in the third quarter. Meanwhile, Micron CEO Sanjaymehrotra also stated that HBM's production capacity has been fully sold out this year, and it is expected that its HBM products will make a positive contribution to Micron's DRAM business and overall gross margin in the third fiscal quarter. It is recommended to focus on the HBM industry chain: Saiteng Co., Ltd. (603283.SH), Tongfu Microelectronics (002156.SZ), Lianrui New Materials (688300.SH), Huahai Chengke (688535.SH), Shannon Xinchuang (300475.SZ), Jingzhida (), etc. 688627.SH