TSMC 2024 Technology Forum was held on May 23. Wan Ruiyang, director of TSMC's Asia Pacific business division, said that artificial intelligence (AI) is starting the fourth industrial revolution and is also more dependent on high-performance computing (HPC). Wan Ruiyang emphasized that 3D chip stacking and advanced packaging technology are becoming increasingly important. TSMC's advanced semiconductor technology is leading the world. In the future, it will integrate more than 200 billion transistors on a single chip and surpass 1 trillion transistors through 3D packaging.
台积电技术论坛：AI掀起第四次工业革命 挑战1万亿个晶体管
TSMC Technology Forum: AI sets off the fourth industrial revolution and challenges 1 trillion transistors
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