Intel issued a statement on September 18 showing the “industry's first” glass substrate for the next generation of advanced packaging. The goal is to raise the upper limit of the number of transistors in a single package chip to 1 trillion by 2030. Intel said that compared with the current mainstream organic substrates in the industry, glass has unique properties and performs better in terms of flatness, thermal stability, and mechanical stability. “These advantages will enable chip architecture engineers to create higher density and higher performance chip packages for data-intensive tasks such as AI.” According to Intel, the move is expected to push Moore's Law to continue until 2030.