Dinglong Co., Ltd. said on the investor interactive platform on March 13 that the company has made an advance layout in the field of semiconductors and display materials. In addition to integrated circuit CMP process material systematization solutions, the company's key products in the field of advanced packaging materials include: temporary bonding adhesive (TBA), encapsulated photoresist PSPI, underfill (Underfill) and other products. The company's display photoresist (PSPI) has been verified by mainstream display customers and is gradually being released. The company's photoresist for packaging (PSPI) has absorbed technical experience in PI synthesis and industrialization based on the PSPI technology platform for displays, and has now begun sample delivery work to customers.