According to Bowei alloy, in recent years, many mobile electronics / high-performance computing companies have paid attention to the heat dissipation of 5G devices and invested in the research and development of new and efficient thermal management technologies and products. In this context, the 5G Thermal Management Industry Summit Forum will be held in Shenzhen on August 7. Bowei Alloy was invited to participate in the exhibition and share the lecture on "Application of High performance Copper Alloy in Thermal Management". Vivo, XIAOMI, Huawei and other engineers also attended the forum.