On June 29th, Intel Corp Research Institute announced that its integrated optoelectronic research has made significant progress, which is the next frontier area to improve the interconnection bandwidth of computing chips in and across data centers. This latest research has made a leading progress in the field of multi-wavelength integrated optics, showing an eight-wavelength distributed feedback (DFB) laser array fully integrated on silicon wafers, with output power uniformity of + /-0.25dB (dB) and wavelength spacing uniformity of ±6.5%, which are better than industry specifications. Rong Haisheng, senior chief engineer of Intel Corp Research Institute, said: "this new study shows that uniform and dense wavelengths and well-matched output power can be achieved at the same time, and most importantly, this can be achieved using the existing production and process control technology of Intel Corp wafer fab. Therefore, it provides a clear path for the mass production of the next generation of optoelectronic co-packaging and optical interconnection devices. "